As a specialized distributor, MH&W offers Chang Sung Corp (CSC) gap filler liquids as a high-performance “dispense-in-place” alternative to traditional thermal pads. These materials excel in automotive and mobile applications by filling complex voids with minimal pressure, providing the superior thermal conductivity of grease without the risk of pump-out or migration. This versatile solution ensures long-term stability and reliable heat dissipation, making it ideal for the high-density components found in next-generation electronic assemblies.