As a strategic distributor for Chang Sung Corporation, MH&W provides high-performance gap filler pads that combine superior mechanical flexibility with versatile heat dissipation options. From the economical, highly conformable pads designed for uneven surfaces in power semiconductors and automotive electronics to the high-conductivity solutions tailored for high-density CPUs and power LED modules, these materials ensure reliable, UL-94 V-0 rated protection. Engineered to bridge significant air gaps while maintaining thermal contact under low pressure, these gap fillers provide stable performance across extreme industrial temperatures ranging from -60°C to +200°C.