Keramold Injection Molding Compound - MH&W International Corp.

Keramold^® Injection Molding

At MH&W, we are proud to offer a sophisticated leap beyond traditional tapes and pads with Keramold^®, an innovative thermally conductive injection molding granulate from Kerafol^®. Utilizing a high-performance TPE polymer base, Keramold^® enables complex 3D geometries that facilitate multidirectional heat transfer while maintaining exceptional electrical insulation. This technology allows for the complete overmolding of electronics, providing a dual-purpose shield against heat, dust, and mechanical stress. With significantly faster processing times than conventional potting, Keramold^® is the ultimate high-efficiency solution for cooling and protecting your most sensitive components in one seamless step.

3D Geometric Flexibility

Unlike flat pads or films, Keramold^® enables the creation of complex 3D shapes and geometries that allow for multidirectional heat transfer tailored to your specific device architecture.

Total Component Encapsulation

Through the overmolding process, electronic components can be completely covered, providing a seamless thermal interface that ensures maximum surface contact and heat dissipation.

Integrated Mechanical Protection

Beyond cooling, Keramold^® acts as a rugged shield, protecting sensitive electronics from dust, moisture, and mechanical influences, effectively replacing the need for separate housings.

High Electrical Insulation

This TPE-based granulate is engineered to provide a high level of electrical insulation, ensuring that even fully encapsulated high-power components remain safely isolated.

High-Speed Manufacturing

As a real alternative to conventional potting materials, Keramold^® significantly reduces assembly cycles due to the fast processing times inherent in injection molding.

Versatile TPE Polymer Base

Formulated as a Thermoplastic Elastomer, the material combines the flexibility of rubber with the processing ease of thermoplastics, offering a durable yet compliant solution for demanding environments.

Why Should I Use Keramold^®?

Superior Shock and Vibration Damping: The soft, TPE-based matrix of Keramold^® provides a Shore A hardness as low as 15–30, allowing it to absorb mechanical energy and protect sensitive electronics from high-vibration environments.

Eco-Friendly Recyclability: Unlike traditional thermoset potting compounds that cannot be reused, Keramold^® is a thermoplastic elastomer that can be melted down and recycled, significantly reducing production waste and supporting sustainable manufacturing goals.

Targeted 2K and Low-Pressure Processing: Keramold^® is optimized for advanced 2K injection molding and low-pressure techniques, ensuring that even the most delicate components are encapsulated safely without the risk of damage from high-injection forces.

Precision Height Compensation: The material acts as a customizable “3D gap pad,” automatically filling varying heights between components to create a defined, high-efficiency heat conduction path to the heat sink in one step.

Who is Kerafol^®?

A family-run specialist in thermal management and technical ceramics, KERAFOL^® leverages decades of expertise to develop high-performance, sustainable solutions for future technologies. Through state-of-the-art manufacturing and dedicated consulting, they provide customized, “cool” electronics support across the mobility and industrial sectors.

Keramold^® Comparison Chart

Product Grade	Thermal Conductivity (W/mK)	Thermal Resistance (K/W)	Breakdown Voltage (kV)	Density (g/cm³)	Hardness (Shore A)	Application Temp (°C)	Datasheet
Keramold^® 15	1.5	1.66	>16	1.90	65-80	-40 to +125	PDF
Keramold^® 20	2.0	0.63	3.0	1.91	15-30	-40 to +100	PDF
Keramold^® 20N	2.0	0.63	3.0	1.91	30-45	-40 to +125	PDF
Keramold^® 25	2.5	0.50	>16	1.88	40-60	-40 to +125	PDF

Frequently Asked Questions

What is the main advantage of using Keramold^® over traditional pre-cut gap pads?

The primary advantage is stress-free application. Keramold^® is applied in a liquid or paste-like state, it fills complex geometries and microscopic surface irregularities without requiring the high compression forces that solid pads do. This makes it ideal for fragile components or boards where mechanical stress must be minimized.

Does Keramold^® require a specific curing environment or high temperatures?

No, Keramold^® is designed as a room-temperature curing (RTV) material. Once applied, it will cure at ambient temperatures, though the process can often be accelerated with mild heat if production speed is a priority. Once cured, it remains a soft, elastic solid that maintains its shape and thermal path.

Can Keramold^® be used as a structural adhesive?

While Keramold^® has excellent wetting properties and will “grip” surfaces, it is not a structural adhesive. It is designed to be a thermal interface material (TIM). If your application requires high mechanical bond strength to hold a heavy heatsink in place against gravity or vibration, additional mechanical fasteners (like screws or clips) are recommended.

How does the "curing" process affect future repairs or rework?

Despite being a cured material, Keramold^® is formulated to remain relatively soft (as seen in the Shore A hardness ratings in the table). This allows the material to be peeled or scraped away during rework without damaging the delicate electronic components underneath, unlike rigid epoxies.

What is the difference between Keramold^® 20 and 20N?

While both offer a thermal conductivity of 2.0 W/mK, the primary difference lies in their mechanical properties and temperature resistance. Keramold^® 20N is a slightly firmer version (Hardness 30-45 Shore A) and offers a higher continuous application temperature of +125°C, compared to the +100°C limit of the standard Keramold^® 20.

As thermal demands rise with miniaturization, MH&W’s Thermal Division provides the expertise and Keratherm^® materials necessary to prevent system failure. Contact our engineers for technical support, request an RFQ, or purchase standard sheets directly from our online shop.