Gap Filler Liquids
As electronic components become more compact and complex, MH&W offers Keratherm® Gap Filler Liquids as a high-performance alternative to traditional pads. These two-part, thermally conductive materials flow effortlessly into irregular geometries and intricate gaps, ensuring total surface contact and superior heat transfer. By providing excellent electrical insulation and low-stress application, Keratherm® liquids protect fragile assemblies while supporting high-volume, automated dispensing for a more efficient and reliable manufacturing process.
Superior Surface Coverage
High Thermal Performance
Stress-Free Assembly
Exceptional Electrical Insulation
Long-Term Reliability
Optimized for Automation
Why should i use Gap Filler Liquids?
Tolerance Compensation: These liquids easily bridge varying gap heights and component tolerances within a single application, eliminating the need to stock multiple pad thicknesses for different areas of a PCB.
Vibration and Shock Dampening: Once cured, the elastic properties of the gap filler provide a cushioned interface that absorbs mechanical vibrations and protects internal components from physical shock in harsh environments.
Reduced Material Waste: Unlike die-cut films that leave scrap material behind, liquid dispensing is a “zero-waste” process that applies only the exact amount of material required for each specific component.
Enhanced Component Wet-Out: The liquid’s ability to “wet” the surface at a microscopic level eliminates trapped air pockets more effectively than solid materials, significantly reducing overall thermal interface resistance.
Who is Kerafol®?
Gap Filler Liquid Comparison
| Product | Viscosity (Pas) | Curing (h@RT) | Thermal Cond. (W/mK) | Thermal Res. (K/W) | Breakdown Volt. (kV) | Dielectric (kV/mm) | Measured Thick. (mm) | Hardness (Shore 00) | App. Temp (°C) | Density (g/cm³) | Datasheet |
|---|---|---|---|---|---|---|---|---|---|---|---|
| GFL 3020 | 45 - 70 | 1 | 1.8 | 0.7 | 10.0 | 20.0 | 0.5 | 45 - 60 | -40 to +200 | 2.3 | |
| GFL 3025 | 45 - 75 | 1 | 2.5 | 0.5 | 8.0 | 16.0 | 0.5 | 65 - 85 | -40 to +200 | 2.83 | |
| GFL 3030 | 50 - 80 | 1 | 3.0 | 0.41 | 6.0 | 12.0 | 0.5 | 65 - 85 | -40 to +200 | 2.94 | |
| GFL 3040 | 75 - 110 | 1 | 4.0 | 0.29 | 5.0 | 10.0 | 0.5 | 65 - 85 | -40 to +200 | 3.05 | |
| GFL 1800 SL | 2 - 7 | 1 | 1.8 | 0.69 | 7.5 | 15.0 | 0.5 | 55 - 75 | -40 to +200 | 2.3 | |
| GFL 3000 SL | 10 - 30 | 1 | 2.8 | 0.9 | 6 | 12.0 | 0.5 | 55 - 75 | -40 to +200 | 2.77 | |
| GFU 15 Silicone Free | A/B: 140-160 | <24 | 1.5 | 0.8 | 8 | 16.0 | 0.5 | 65 - 85 | -40 to +80 | 2.3 |
Frequently Asked Questions
What exactly are Keratherm® Gap Filler Liquids compared to standard thermal grease?
Is it safe to use these on fragile or sensitive electronic components?
These materials are actually ideal for delicate setups. Because they are applied in a liquid state, they require almost zero assembly pressure to spread across a surface. This eliminates the mechanical stress often caused by squeezing a firm thermal pad onto a board, which protects fragile solder joints and sensitive surface-mount devices from cracking during the manufacturing process.
What kind of equipment is required for the application process?
How does the curing process work and how long does it take?
What are the key technical specs to consider when choosing a version?
As thermal demands rise with miniaturization, MH&W’s Thermal Division provides the expertise and Keratherm® materials necessary to prevent system failure. Contact our engineers for technical support, request an RFQ, or purchase standard sheets directly from our online shop.