Thermal Interface Materials
With the high packing density of power semiconductors, transistor chips and discrete components, etc., the generated heat has to be conducted away as efficiently as possible. MH&W has solutions for almost every type of heat problem and application by offering films, adhesive tapes, thermal grease, gap fillers and other material forms from a variety of manufacturers.
Standard Films
Standard films are dielectric film materials used in capacitors to provide electrical insulation and stable energy storage in electronic circuits.
Gap Filler Pads
Gap filler pads are soft thermal interface materials used to fill air gaps between components and heat sinks to improve heat transfer in electronic devices.
Thermal Grease
Thermal grease is a heat-conductive compound applied between electronic components and heat sinks to improve heat transfer and reduce overheating.
Injection Molding Compound
Injection molding compounds are materials used to form plastic components by injecting melted material into molds.
EMI Absorber
EMI absorbers are materials that absorb electromagnetic interference to reduce noise and improve electronic performance.
Double-Sided Adhesive Films
thin adhesive layers on both sides used to bond components together in electronic and industrial applications.
Gap Filler Liquids
Gap filler liquids are liquid thermal interface materials that fill gaps between components to improve heat transfer.
Graphite Material
Graphite materials are thermally conductive materials used to spread and dissipate heat in electronic devices.