Gap Filler Pads

To address the rising power densities and irregular surface geometries in modern electronics, MH&W provides high-performance gap filler solutions from both Kerafol^® and Chang Sung Corporation. We offer the Softtherm^® range from Kerafol^®, featuring ultra-soft, highly compressible pads designed to displace air in large cavities and bridge varying distances with minimal mechanical stress. Complementing this, our Chang Sung portfolio includes versatile pads ranging from economical, conformable options for automotive electronics to high-conductivity solutions for high-density CPUs. These UL-94 V-0 rated materials ensure reliable thermal contact under low pressure across extreme temperatures from -60°C to +200°C, effectively eliminating air gaps to maintain system stability in complex assemblies.